Integrated circuit package
173
2023-08-01
Integrated circuit package
The earliest integrated circuit was packaged by ceramic flat packaging. This packaging continued to be used by the military for many years because of reliability and small size.Commercial circuit packaging quickly changed to dual -column direct packaging. In short, it started to be ceramics, and then plastic.In the 1980s, the pins of the VLSI circuit exceeded the application restrictions of DIP packaging, which finally led to the emergence of the array and chip carrier of the pins.
The surface sticky technology appeared in the early 1980s, and it became popular in the late period.Its pins use thinner spacing, and the pins shape is a seagull wing type or J.Take Small-Outline Integrated Circuit (SOIC) as an example. It is 30-50%less than the equal DIP area and 70%less thick.This encapsulation is prominent with seagull wing pins on the two long sides, with a pink distance of 0.05 inches.
Small-Outline Integrated Circuit (SOIC) and PLCC packaging.In the 1990s, although PGA packaging was still often used in high -end micro -processors.PQFP and Thin Small-OUTLINE PACKAGE (TSOP) become generally encapsulated for high-footing devices.Intel and AMD's high -end microprocessors are now encapsulated from PGA (Pine Grid Array) to the Land Grid Array (LGA) packaging.
The packaging packaging packaging began in the 1970s, and in the 1990s, the sculpture ball array packaged with more feet than other packages.In FCBGA packaging, the grains are installed up and down (FLIPPED), which is connected to the welded balls that are similar to PCB instead of wires like PCB instead of wires.FCBGA packaging makes the input and output signal array (called I/O area) distributed on the surface of the entire chip, not limited to the periphery of the chip.In today's market, encapsulation is also an independent part, and the packaging technology will also affect the quality and yield of the product.
