Wafer manufacturing process
197
2023-08-01
Wafer manufacturing process
To put it simply, first refined by ordinary silicon sand and rose. After dissolving, purifying, and distillation, a series of measures are made into single crystal silicon rods. After the single crystal silicon rod is sliced and polished, the single crystal silicon round sheet is obtained, that is, that is,Single crystal silicon wafer.
After mixing the silica ore (quartz sand) with the coke, heated and restore it through the arc furnace, that is, the coarse silicon (purity 98%, metallurgy).SiO2 + C = SI + CO2 ↑
After chloride and distillation of hydrochloride, a high -purity polysilicon (semiconductor -grade purity 11 9 and 7 9 9) are made. Due to the precision electronic component, silicon wafers need a considerable purity (99999999999%).Otherwise, there will be defects.
The wafer manufacturing factory then melts this polycrystalline silicon in the chakrasky method, and then mixes a small grain of silicone crystal species in the solution, and then slowly pulls it out to form a cylindrical monocrystalline silicon crystal stick.Since the silicon crystal rod is gradually generated in a melting silicon raw material, this process is called "long crystal".The diameter of this crystal stick is the diameter of the wafer.
After slice, grinding, and polishing, the silicon crystal rod becomes the basic raw material of the integrated circuit factory -silicon wafer sheet, which is the "WAFER).
The wafers are treated multiple times, and each step includes the sensor coating, exposure, development, corrosion, penetration, implantation, etching, or steamingOn the top, the IC wafers with multi -layer lines and components are made, and then the test, cutting, and packaging factories in the rear section are made to make the finished product of an integrated circuit.Generally speaking, large wafers (12 -inch) are mostly used to make ICs with lower technical levels such as memory, while small wafers (6 inches) are mostly used to make ICs with higher technical levels such as analog IC.There are.
From the wafer, it needs to be processed into a product and requires professional and fine division of labor.
