H-F3DFO1T
1. Chart Outline DimensionsThe
Unit unit |
Tolerance tolerance |
Chip material DIE MATERIAL |
Color color Lens color |
Emitting color |
mm |
± 0.2mm |
Algainp |
White Diffused |
Orange |
two,Optical parameters Photo Electricity Parameter
(Ambient temperature Ambient tempicure: 25 ℃ humidity Humidity: RH60%)
project Item |
symbol Symbol |
Test Conditions TestCondition |
Minimum Min |
Typical Type |
Maximum Max |
unit Unit |
Forward Voltage Forward Voltage |
VF |
If = 20mA |
1.8 |
/ / |
2.4 |
V |
Reverse current Reverse Current |
Ir |
VR = 5V |
/ / |
/ / |
10 |
μA |
light intensity Luminous intensity |
IV |
If = 20mA |
280 |
500 |
/ / |
MCD |
Main wavelength Dominant wavelength |
λD |
If = 20mA |
600 |
/ / |
605 |
NM |
Halflight strong angle Viewing angle |
2θ1/2 |
If = 20mA |
/ / |
30 |
/ / |
DEG. |
Remarks: Brightness test tolerance ±15%, Waveleva Test Tolerance ± ±1NM, Positive voltage test tolerance ±0.05V
RemarkTheThe tolerance of intensity: ± 15%, The Tolerance of Wave Length: ± 1Nm, The TOLARANCE of Forwards Voltage: ± 0.05v. Only Reference for ABove Data When Testing.
3. Extreme parameter ABSOLUTE MAXIMUM RATING
(Ambient temperature Ambient tempicureThe25℃ humidity HumidityTheRH60%.
project Item |
symbol Symbol |
Value Value |
unit Unit |
Remark Remark |
Positive current Forward Current |
If |
25 |
ma |
--- |
Dispersion power Power DISSIPATION |
PD |
100 |
MW |
--- |
Working temperature Operation temperature |
TOPR |
-40TO+85 |
℃ |
--- |
Storage temperature Storage Temperanture |
TSTG |
-40TO+100 |
℃ |
--- |
Welding temperature Soldering Temperanture |
TSOL |
260±5 |
℃ |
Less than 5 Second |
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