The industry's first 丨 Panasonic's latest high-heat conduction multi-layer substrate "R-2400"
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2023-08-01
Panasonic Electromechanical Co., Ltd. (Corporation: Osaka Mansion, Chairman and President Executive Director, CEO: Sakamoto Nanta) developed high-heat conductive multi-layer substrate "R-2400".
In recent years, as people's attention to environmental issues has become higher and higher, electric vehicles (XEV) have also continued to popularize.In order to improve the energy efficiency of electric vehicles, as the power of batteries, power supply departments, and drivers has further improved, the industry's demand for power semiconductors such as SIC and GAN has continued to increase, and the heat management of equipment has become a major issue.In addition, in order to increase the mileage of electric vehicles and expand the space in the vehicle to improve comfort, the demand with lighter weight and smaller volume of power departments and drivers has continued to increase.
In this regard, the company has developed a film "R-2400" for high-heat conduction multi-layer substrates. It also has the industry's first (※ 1) high heat conduction and realization of high heat conduction and realization of 2.7W/m ・ K (※ 2)Outstanding resin liquidity of multi -layer substrates.
While relieved the influence of power semiconductor thermal heating, new products can also be suitable for multi -layer substrates that are difficult to achieve in traditional high -thermal conduction materials. In the future, it is expected to built -in components and suitable for thick copper foil.This can help reduce the weight of the power supply department and the driver department, and achieve miniaturizing the power consumption of electric vehicles (improving energy efficiency), and help reduce CO ₂ emissions.
【Features】
1.As a multi -layer substrate, it has the industry's first thermal conduction rate 2.7w/m ・ k (※ 2) to help reduce the number of components of the heating countermeasures
2.Using good resin liquidity, the number of layers of electronic circuit substrates can be used to help to achieve miniaturization of equipment
3.Get UL's rated temperature 150 ° C, and can be used in high temperature environments
